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Place of Origin : Guangdong, China
Brand Name : ShinEtsu
Model Number : ShinEtsu KE-3494
Price : CN¥334.46/pieces 1-99 pieces
product name : ShinEtsu KE-3494
Package : 330ML/Piece
Specific Gravity : 1.40 g/cc
Viscosity : 50000 cP
Hardness, Shore A : 35
Tensile Strength : 2.50 MPa
Thermal Conductivity : 0.420 W/m-K
Cure Time : 8.00 min
Property | English Value | Comments |
---|---|---|
Specific Gravity | 1.40 g/cc | |
Viscosity | 50000 cP | |
Hardness, Shore A | 35 | |
Tensile Strength | 363 psi | |
Thermal Conductivity | 2.91 BTU-in/hr-ft²-°F | |
Dissipation Factor | 0.010 | @Frequency 50.0 Hz |
Cure Time | 0.133 hour | Tack Free Time |
Shin-Etsu KE-3494 is a Room Temperature Vulcanizing (RTV) silicone product supplied by Shin-Etsu Silicones of America, Inc. It falls under the category of thermoset polymers and is designed for industrial applications, offering excellent processing performance and reliability. Distributed by Songhan Plastic Technology Co., Ltd., this product is suitable for scenarios requiring rapid curing and stable performance.
This section elaborates on the properties from the first table. KE-3494's special attributes derive from its documented data: a specific gravity of 1.40 g/cc indicates moderate density for easy handling; viscosity of 50,000 cP suggests a thick consistency suitable for extrusion or coating; Shore A hardness of 35 demonstrates high flexibility for absorbing mechanical stress; tensile strength of 2.50 MPa (363 psi) provides good resistance to stretching; thermal conductivity of 0.420 W/m-K offers moderate heat transfer for temperature management; dissipation factor of 0.010 @ 50 Hz shows low electrical loss, ideal for high-frequency insulation; and a cure time of just 8 minutes (tack-free time) ensures rapid application and efficient production. These combined properties make it excel in demanding environments.
Ideal for potting sensors in smartphones or circuit boards in wearables. Low viscosity fills micro-gaps, fast curing suits production lines, softness absorbs shocks, and thermal conductivity dissipates heat from compact components.
Encapsulates low-wattage LED chips on substrates. Enhanced thermal conductivity extends LED lifespan by dissipating heat, while dielectric properties prevent current leakage and flexibility relieves thermal stress on solder joints.
Protects vibration-sensitive sensors (e.g., accelerometers) in motors/pumps. Soft Shore A 35 absorbs shocks, tensile strength resists mounting stress, and rapid curing enables on-site maintenance.
Coats terminals/connectors to prevent moisture ingress and short circuits. Stable dielectric properties at 50Hz (common AC frequency) and flexibility accommodate thermal cycling without cracking.
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Shin-Etsu KE-3494 RTV Silicone for Electrical Insulation and Sealing Images |