Momentive TN3405-C Electronic Component Encapsulation Silicone Adhesive
Product Properties
| Criteria | Properties |
| Appearance | Flowable, clear color |
| Viscosity | 30 Pa.s |
| Tack-free Time (23°C) | 7 min |
| Cured Properties (3 days @23°C, 50% RH) |
|
| Appearance | Clear elastic rubber |
| Density (23°C) | 1.02 g/cm³ |
| Hardness (Type A) | 17 |
| Tensile Strength | 1.3 MPa |
| Elongation | 260 % |
| Adhesion Strength¹ | 0.8 MPa |
| Volatile Siloxane² (D3~D10) | 100 ppm |
| Volume Resistivity | 2.0 × 10¹⁵ Ω·cm |
| Dielectric Strength | 25 kV/mm |
| Dielectric Constant (60Hz) | 2.7 |
| Dissipation Factor (60Hz) | 0.01 |
| Impurities² (Na+, K+, Cl-) | each < 2 ppm |
*1: glass lap shear, 7 days @23°C, 50% RH
*2: In-house test method
Note: Typical properties are average data and are not to be used as or to develop specifications.
Product Introduction
Momentive TN3405-C is a one-component silicone adhesive sealant designed for encapsulant applications. It cures at room temperature upon exposure to atmospheric moisture, eliminating the need for primers on many substrates. Key features include fast tack-free time (7 minutes at 23°C), low volatility, and minimal odor during cure, which releases only alcohol vapor. The cured product forms a clear elastic rubber with excellent electrical properties, such as high volume resistivity and low dissipation factor, making it suitable for sensitive electronic environments. Packaging is available in 333ml cartridges for easy application.
Enhanced Properties
Deepening the physical properties, Momentive TN3405-C exhibits low hardness (17 Type A) and high elongation (260%), which provide exceptional flexibility and durability for dynamic stress environments. Its adhesion strength of 0.8 MPa to glass and primerless adhesion to substrates like aluminum, copper, phenolic resin, and epoxy resin (as per adhesion performance table) ensure reliable bonding without additional surface treatment. The product operates effectively over a wide temperature range (-45°C to 200°C), with low volatile siloxane content (100 ppm) minimizing environmental impact during cure. Electrical properties, such as dielectric strength of 25 kV/mm and dissipation factor of 0.01 at 60Hz, make it ideal for high-insulation applications, while impurities (each <2 ppm for Na+, K+, Cl-) guarantee purity for sensitive components.
Application Scenarios
general applications for silicone encapsulants include potting and sealing in electronics.
FAQ
1. Who are we?
We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).
2. What products do you offer?
we supply high-performance adhesives and sealants from global leaders including:
Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.
3. How do you guarantee product quality?
Quality assurance through:
Mandatory pre-production samples approval
Final inspection by QC team before shipment
International certifications: SGS, UL, FDA, RoHS, REACH
4. Why choose us over other suppliers?
Reliable Supply:Authentic products from top manufacturers
Expert Support:Technical guidance for product selection
Global Compliance:Certifications meeting target market standards
Efficient Service:Customized solutions & professional support
5. What services do you provide?
Delivery:EXW/FOB/CIF
Payment:USD/EUR/CNY/HKD via T/T, L/C
Support:Technical consultation & logistics coordination
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Momentive TN3405-C Electronic Component Encapsulation Silicone Adhesive Images
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